델 파워엣지 R860 | 4S SAP HANA & 16TB DDR5 Server - Xinchuan 서버 | 엔터프라이즈 서버 하드웨어 공급업체

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델 파워엣지 R860 | 4S SAP HANA & 16TB DDR5 Server

Four Sockets in 2U: Why the R860 Exists The PowerEdge R860 answers a specific question: what do you do when two sockets cannot hold the working set? SAP HANA scale-up, large in-memory analytics and consolidated 4-socket databases need more memory than any 2-socket node can carryand the R860 delivers up to 16TB of DDR5 in a standard 2U chassis, replacing the older R840 with a Gen5-era platform. Platform Overview Attribute R860 Form factor 2U rack, 869.2 mm 깊이 (no bezel) Processors Up to 4x 4th Gen Intel Xeon Scalable, 까지 60 코어 각각, 350승 TDP, 80 PCIe 5.0 lanes per CPU Memory 64 DDR5 RDIMM 슬롯, up to 16TB; 4800 MT/s (1 DPC) / 4400 MT/s (2…

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Four Sockets in 2U: Why the R860 Exists

The PowerEdge R860 answers a specific question: what do you do when two sockets cannot hold the working set? SAP HANA scale-up, large in-memory analytics and consolidated 4-socket databases need more memory than any 2-socket node can carryand the R860 delivers up to 16TB of DDR5 in a standard 2U chassis, replacing the older R840 with a Gen5-era platform.

Platform Overview

기인하다 R860
폼 팩터 2U 랙, 869.2 mm 깊이 (no bezel)
프로세서 최대 4개의 4세대 Intel Xeon 확장 가능, 까지 60 코어 각각, 350승 TDP, 80 PCIe 5.0 CPU당 레인
메모리 64 DDR5 RDIMM 슬롯, up to 16TB; 4800 MT/s (1 DPC) / 4400 MT/s (2 DPC)
저장 Up to 24x 2.5-inch SAS/SATA/NVMe or 8x E3.S Gen5 (앞쪽) + 2x 2.5-inch or 4x E3.S Gen5 (뒤쪽)
PCIe Up to 8x PCIe Gen5 x16 slots; OCP Mezzanine 3.0
RAID PERC 11/12 (H755, H965i/H965e), HBA465i/e, 보스 -N1, software RAID S160
관리 iDRAC9, iDRAC 다이렉트, 레드피시 API, 빠른 동기화 2
2x redundant PSU: Titanium 1100W, Platinum 1400W, Titanium 1800W, Platinum 2400W (AC/HVDC)
Dell PowerEdge R860 24-bay front view
Up to 24x 2.5-inch SAS/SATA/NVMe bays on the front of the R860, or 8x EDSFF E3.S Gen5 drives.

Config Calculator: SAP HANA Memory Sizing

  1. Working set: sum of hot data + column-store + delta + 20% headroom. A 4TB HANA database with 1:2 compression needs roughly 2.2-2.5TB of server memory.
  2. DIMM plan: 64 슬롯. 1 DPC runs 4800 MT/s but caps capacity; 2 DPC reaches 16TB at 4400 MT/s. For HANA, capacity beats peak speedrun 2 DPC with 256GB RDIMMs (8TB class) or 512GB (16TB class) if the budget allows.
  3. Verify NUMA: four sockets mean four NUMA domains; pin HANA instances and their memory pools per socket to avoid cross-socket traffic.
  4. Boot and log: 보스 -N1 (2x M.2 NVMe RAID1) for boot, E3.S Gen5 NVMe for HANA data/log/backup volumes.

R840 to R860 Migration

R840 (previous gen) R860
48 DDR4 DIMM + Optane PMem 64 DDR5 RDIMM, up to 16TB, no PMem dependency
PCIe Gen3 slots Up to 8x PCIe Gen5 x16 slots
PERC 9/10 (H740p/H840) PERC 11/12 (H965i/H965e), HBA465
24G SAS/6G SATA, Gen3/4 NVMe 24G SAS, Gen4 NVMe, plus E3.S Gen5 front/rear
865.9 mm 깊이 869.2 mm 깊이 – rack depth check required

The migration path is export-backup-restore: back up HANA at the storage layer, restore onto the R860’s NVMe, then re-point the scale-up licenses. Expect materially faster column scans on Gen5 NVMe and DDR5 bandwidth.

Dell PowerEdge R860 E3.S front configuration
The E3.S Gen5 front configuration trades bay count for NVMe Gen5 densitythe right call for HANA data and log volumes.

Procurement Traps on 4-Socket Servers

  • License math: SAP HANA is licensed per GB of memorya 16TB R860 costs far more in license than hardware. Size the DB, then size the box, not the reverse.
  • Memory topology: verify 1 DPC vs 2 DPC speeds in the quote; vendors quoting 4800 MT/s on a full 16TB build are not reading the spec sheet.
  • 후면 베이: 24x 2.5-inch front config leaves rear room for 2x 2.5-inch or 4x E3.Sconfirm the backplane SKU matches your boot/NVMe plan.
  • PSU class: 4x 350W CPUs plus 24 drives can exceed 2kW; order 2400W Platinum pair, not 1100W.
  • Rack depth: 869.2mm is long for standard 800mm cabinetsverify cable management arms and rail fit.
Dell PowerEdge R860 rear I/O view
Rear I/O carries iDRAC Ethernet, USB 3.0/2.0, VGA and the OCP Mezzanine 3.0 슬롯; serial is optional via the STD RIO board.

Workload Fit

  • SAP HANA scale-up: the primary design point – 우리를 보아라 SAP HANA deployment guide for R960/R860 sizing.
  • Large in-memory analytics: 64 DDR5 slots beat any 2-socket node for column-store analytics.
  • Consolidated databases: run multiple mission databases with resource isolation on one 4-socket host instead of several 2-socket boxes.
  • VDI and desktop virtualization: high-core-count 4S nodes sustain dense RDSH pools.

Detailed Specs, Dimension by Dimension

네트워킹

  • LOM board: 2x 1GbE with Broadcom BCM5720 (선택 과목)
  • OCP Mezzanine 3.0 slot supported by up to 16 PCIe 레인 – 25GbE/100GbE mezz options
  • PCIe Gen5 slots carry full-height NICs at 32 GT/s when network density demands

Front and Rear I/O

  • 앞쪽: 1x USB 2.0, 1x iDRAC 다이렉트 (마이크로 AB USB), 1×VGA
  • 뒤쪽: 1x dedicated iDRAC Ethernet, 1x USB 3.0, 1x USB 2.0, 1×VGA (optional on liquid-cooled configs), optional serial via STD RIO board
  • 내부: 1x USB 3.0; optional LCD bezel or security bezel

Riser and PCIe Architecture

  • 80 PCIe 5.0 lanes per CPU at 32 GT/s; up to 8x Gen5 x16 slots system-wide
  • Flexible riser layout across sockets 1-4; plan slot-to-NUMA affinity before ordering

RAID 및 부팅

  • PERC 11: H355, H755; PERC 12: H965i, H965E (트라이 모드)
  • HBA 11/12: HBA355i/e, HBA465i/e
  • BOSS-N1 for OS boot (2x M.2 NVMe, 하드웨어 RAID 1); software RAID S160 for SATA

보안

  • TPM 2.0, UEFI 보안 부팅, 실리콘 루트 오브 트러스트, signed firmware and secure boot chain verified at every POSTDell PowerEdge platform security baseline

관리

  • iDRAC9: remote console, 가상 미디어, 원격 측정 스트리밍, lifecycle log
  • iDRAC Direct via Micro-AB USB; Redfish RESTful API; RACADM; 빠른 동기화 2
  • OpenManage 엔터프라이즈, Ansible and Terraform modules, ServiceNow and System Center integrations

Physical and Environmental

  • 2U 랙; 869.2 mm 깊이 (no bezel); 기준 482 mm width, 86.8 mm 높이
  • Operating ambient 10-35 당신 C; extended ranges available on qualified configs

운영 체제

  • VM웨어 ESXi, Windows Server with Hyper-V, RHEL, SLES, Ubuntu Server LTSDell certified releases per OS Support matrix

  • Two redundant PSUs (1+1): Titanium 1100W, Platinum 1400W, Titanium 1800W, Platinum 2400W AC/HVDC
  • 60mm PSU form factor on 15G design; 86mm 2400W class for maximum headroom

4-Socket Platform Matrix

플랫폼 폼 팩터 메모리 다음에 가장 적합
R860 2유, 869mm 64 DR5, 16결핵 Density-constrained 4S scale-up
R960 4유 64 DR5, 16결핵, 12x PCIe Gen5 Maximum expansion and GPU-assisted
R7715 2U single EPYC 9005 24 DR5, 6결핵 Per-socket licensing cost focus
R770 2U dual Xeon 6 32 DR5, 8결핵 Workloads that fit two sockets

Deployment Snapshot: In-Memory Analytics Consolidation

A regional bank consolidated six 2-socket analytics nodes into two R860s. The win was memory: 4.5TB of usable HANA working set across 128 DDR5 slots with room to grow, versus 2.4TB across the old fleet. Cross-socket NUMA pinning held column scans within socket-local memory, and the 8x E3.S Gen5 NVMe layout carried the data/log tier at Gen5 bandwidth. PDU power dropped from 8.2kW to 5.1kW after decommissioning the legacy nodes.

Ordering Checklist: What to Verify Before Signing

  • Memory plan on paper: request the exact DIMM map (계급, DPC, speed per slot) – a 16TB quote at 4800 MT/s is a red flag unless it is 1 DPC.
  • Backplane SKU: confirm front bay type (24x 2.5-inch vs 8x E3.S) and rear bay option (2x 2.5-inch or 4x E3.S) match the storage design.
  • PERC class: H965i (내부) vs H965e (외부) – expansion enclosures need the ‘evariant with external ports.
  • PSU and power cords: 2400W Platinum pair for 4x 350W CPU builds; verify C19-style cord/PDU compatibility at 200-240V.
  • iDRAC licensing tier: confirm iDRAC9 Enterprise entitlement in the quote for telemetry and virtual media.
  • Rack depth survey: measure rail-to-rail depth with cable arms; 869.2mm chassis needs a 1000mm+ cabinet or a rear offset kit.

Lifecycle and Support

The R860 is a 4th Gen Xeon Scalable platform with a long support tail: Dell keeps firmware, driver and OS certification matrices current through the platform’s standard lifecycle, and iDRAC9 telemetry feeds OpenManage Enterprise for proactive alerting. For mission databases, pair the platform with Dell ProSupport Plus or a partner-managed 3-year warranty planour standard quote includes 3-year warranty, 공장 직접 가격, 글로벌 배송 및 무료 구성 상담, with optional on-site NBD for production HANA nodes. Spares strategy: keep one 2400W PSU, one PERC H965i and one E3.S boot drive on the shelf per cluster to cut MTTR to minutes.

구매 FAQ

  • Why choose R860 over R960? Both are 4-socket; R860 is 2U (869mm) ~와 함께 64 DDR5 슬롯, R960 is 4U with more drives and PCIe slots. Choose R860 for density, R960 for maximum expansion.
  • Does it support E3.S Gen5 drives? 예 – 8x E3.S front (and 4x rear in the 24x 2.5-inch config).
  • What management does it ship with? iDRAC9 with iDRAC Direct, Redfish RESTful API, 빠른 동기화 2, OpenManage Enterprise and Ansible/Terraform modules.
  • Can the R860 run 4th Gen Xeon Scalable and newer CPUs? It is designed for 4th Gen Xeon Scalable (까지 60 코어, 350승); 제온용 6 workloads look at the R670/R770 generation instead.
  • How many drives can it hold? Up to 24x 2.5-inch front (SAS/SATA/NVME) plus 2x 2.5-inch or 4x E3.S rear, or 8x E3.S Gen5 frontpick the backplane variant that matches the workload.
  • 보증? As an authorized Dell partner we quote factory-direct pricing with 3-year warranty, 글로벌 배송 및 무료 상담 – including HANA sizing and memory topology validation.

The R860 is the density answer for scale-up memory workloads: four sockets, 64 DDR5 slots and up to 16TB in a standard 2U footprint. Sizing a 4-socket platform? 문의하기 for a configuration worksheet covering memory topology, NVMe layout and PSU class for your exact database workload, with a per-socket NUMA map and a license-cost comparison against the 2-socket alternative.

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