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델 파워엣지 R670 – 1U 듀얼 제온 6 클라우드 네이티브 및 HPC 워크로드용 서버

Double the Compute in a Single Rack UnitThe Dell PowerEdge R670 packs dual Intel Xeon 6 processors into a 1U chassis - 전달 288 E-코어 또는 172 P-cores in the rack space that once held a single-socket server. 와 함께 32 DDR5 DIMMS (8 TB at 6400 MT/s), 까지 20 E3.S Gen5 NVMe bays, and dual OCP 3.0 mezzanine slots, the R670 is purpose-built for cloud-native infrastructure, all-flash software-defined storage, and dense HPC clusters where every rack unit counts.Key SpecificationsComponentSpecificationForm Factor1U rack server (dual-socket)Processor2x Intel Xeon 6 (까지 144 E-코어 또는 86 P-cores per CPU)Memory32 DDR5 DIMMs, 까지 8 결핵 (6400 MT/s)StorageFront: Up to 8/16/20x E3.S Gen5 NVMe or 8/10x 2.5-inch SAS/SATANVMeFull E3.S Gen5 support across

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Double the Compute in a Single Rack Unit

The Dell PowerEdge R670 packs dual Intel Xeon 6 processors into a 1U chassis – 전달 288 E-코어 또는 172 P-cores in the rack space that once held a single-socket server. 와 함께 32 DDR5 DIMMS (8 TB at 6400 MT/s), 까지 20 E3.S Gen5 NVMe bays, and dual OCP 3.0 mezzanine slots, the R670 is purpose-built for cloud-native infrastructure, all-flash software-defined storage, and dense HPC clusters where every rack unit counts.

Key Specifications

요소 사양
폼 팩터 1U 랙 서버 (dual-socket)
프로세서 2x Intel Xeon 6 (까지 144 E-코어 또는 86 P-cores per CPU)
메모리 32 DDR5 DIMMS, 까지 8 결핵 (6400 MT/s)
저장 앞쪽: Up to 8/16/20x E3.S Gen5 NVMe or 8/10x 2.5-inch SAS/SATA
NVMe Full E3.S Gen5 support across all bays
PCIe Multiple Gen5 slots + 2x OCP 3.0 mezzanine
GPU 지원 Up to 3x 75W single-wide accelerators
전원공급장치 800W/1100W/1400W/1500W/1800W redundant
관리 iDRAC9 Enterprise, OpenManage, Redfish API

Ideal Workloads

  • Cloud-Native Kubernetes: 288 E-cores per node in 1U enables extreme container density for microservices, API gateways, and serverless platforms. Pair with E3.S NVMe for ephemeral storage that does not bottleneck pod scheduling.
  • All-Flash SDS: Ceph, VMware vSAN, and MinIO clusters benefit from the R670’s E3.S Gen5 storage baysmore IOPS per rack unit than any 2.5-inch U.2 configuration.
  • High-Performance Computing: Dual-socket Xeon 6 with DDR5-6400 memory bandwidth for simulation, 표현, and computational workloads that scale across hundreds of nodes.
  • Virtualization Consolidation: Replace multiple older 1U servers with R670 nodesmore cores, more memory, and PCIe Gen5 throughput in the same power envelope.

제온 6: E-Cores vs P-Cores

시온 6 processor offers two core architectures in one socket. E-cores (Efficient-cores) maximize thread density for horizontally scaled cloud workloads – 144 cores per socket at lower per-core power. P 코어 (Performance-cores) deliver higher single-thread throughput for databases and latency-sensitive applications. The R670 supports both, letting you match silicon to workload without changing your server platform.

Why Source Through Xincuan?

Factory-direct pricing on the full R670 configuration range. 3-year manufacturer warranty, global shipping, and free pre-sales engineering consultation to right-size your Xeon 6 deployment. We can benchmark your current workload against E-core and P-core configurations to validate the optimal choice.

Request an R670 configuration and quote

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