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Dell Server/

 

Dell PowerEdge R670 — 1U Dual Xeon 6 Server for Cloud-Native and HPC Workloads

Double the Compute in a Single Rack UnitThe Dell PowerEdge R670 packs dual Intel Xeon 6 processors into a 1U chassis - доставка до 288 Электронные ядра или 172 P-cores in the rack space that once held a single-socket server. With 32 DDR5 DIMMS (8 TB at 6400 МТ/с), вплоть до 20 E3.S Gen5 NVMe bays, and dual OCP 3.0 mezzanine slots, the R670 is purpose-built for cloud-native infrastructure, all-flash software-defined storage, and dense HPC clusters where every rack unit counts.Key SpecificationsComponentSpecificationForm Factor1U rack server (dual-socket)Processor2x Intel Xeon 6 (вплоть до 144 Электронные ядра или 86 P-cores per CPU)Memory32 DDR5 DIMMs, вплоть до 8 ТБ (6400 МТ/с)StorageFront: Up to 8/16/20x E3.S Gen5 NVMe or 8/10x 2.5-inch SAS/SATANVMeFull E3.S Gen5 support across

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Double the Compute in a Single Rack Unit

The Dell PowerEdge R670 packs dual Intel Xeon 6 processors into a 1U chassis — доставка до 288 Электронные ядра или 172 P-cores in the rack space that once held a single-socket server. With 32 DDR5 DIMMS (8 TB at 6400 МТ/с), вплоть до 20 E3.S Gen5 NVMe bays, and dual OCP 3.0 mezzanine slots, the R670 is purpose-built for cloud-native infrastructure, all-flash software-defined storage, and dense HPC clusters where every rack unit counts.

Key Specifications

Компонент Спецификация
Фактор формы 1U стоечный сервер (dual-socket)
Процессор 2x Intel Xeon 6 (вплоть до 144 Электронные ядра или 86 P-cores per CPU)
Память 32 DDR5 DIMMS, вплоть до 8 ТБ (6400 МТ/с)
Хранилище Передний: Up to 8/16/20x E3.S Gen5 NVMe or 8/10x 2.5-inch SAS/SATA
NVMe Full E3.S Gen5 support across all bays
PCIe Multiple Gen5 slots + 2х ОКП 3.0 mezzanine
Поддержка графического процессора Up to 3x 75W single-wide accelerators
Источник питания 800W/1100W/1400W/1500W/1800W redundant
Управление iDRAC9 Enterprise, OpenManage, Redfish API

Ideal Workloads

  • Cloud-Native Kubernetes: 288 E-cores per node in 1U enables extreme container density for microservices, API gateways, and serverless platforms. Pair with E3.S NVMe for ephemeral storage that does not bottleneck pod scheduling.
  • All-Flash SDS: Ceph, VMware vSAN, and MinIO clusters benefit from the R670’s E3.S Gen5 storage baysmore IOPS per rack unit than any 2.5-inch U.2 configuration.
  • High-Performance Computing: Dual-socket Xeon 6 with DDR5-6400 memory bandwidth for simulation, рендеринг, and computational workloads that scale across hundreds of nodes.
  • Virtualization Consolidation: Replace multiple older 1U servers with R670 nodesmore cores, more memory, and PCIe Gen5 throughput in the same power envelope.

Ксеон 6: E-Cores vs P-Cores

Ксеон 6 processor offers two core architectures in one socket. E-cores (Efficient-cores) maximize thread density for horizontally scaled cloud workloads — 144 cores per socket at lower per-core power. P-подачи (Performance-cores) deliver higher single-thread throughput for databases and latency-sensitive applications. The R670 supports both, letting you match silicon to workload without changing your server platform.

Why Source Through Xincuan?

Factory-direct pricing on the full R670 configuration range. 3-year manufacturer warranty, global shipping, and free pre-sales engineering consultation to right-size your Xeon 6 deployment. We can benchmark your current workload against E-core and P-core configurations to validate the optimal choice.

Request an R670 configuration and quote

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