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1U 的密度，Xeon 6 的能效：R670 的平衡术

机架密度和功率预算从来是一对矛盾：塞进 1U 的服务器要么牺牲性能，要么牺牲扩展性。Dell PowerEdge R670 用 Intel Xeon 6 的 E-core/P-core 双核架构建成了这个平衡——1U 双路机箱里支持最多 144 个 E-core 或 86 个 P-core 每路，配合 32 条 DDR5-6400 内存和最多 20 块 E3.S Gen5 NVMe，把”密度优先”和”性能优先”两种形态放进同一个平台。相比上一代，R670 提供最高 1.69 倍的每瓦性能，是虚拟化、云原生、全闪 SDS 和高性能计算的密度型选择。

Core Specifications

Attributo	Specifica
Fattore di forma	1Server rack U (rear I/O or front I/O cold-aisle)
Processore	2 x Intel Xeon 6, fino a 144 E-cores or 86 P-cores per CPU
Memoria	32 x DDR5 RDIMM slots, fino a 8 tubercolosi, 6400 MT/s
Magazzinaggio	Fino a 20 xEDSFF E3.S Gen5 NVMe (1228.8 tubercolosi) O 8/10 x 2.5-inch SATA/NVMe
Boot	BOSS-N1 DC-MHS: RAID hardware 1, 2 x M.2 NVMe
RAID	Front PERC H965i / H975i / H365i
Rete	2 x OCP NIC 3.0 slot, 1GbE-400GbE; BlueField-3 DPU options
PCIe	Fino a 5 x Gen5 slots (2 x16 front riser + 3 x16/x8)
GPU	Fino a 3 X 75 W single-wide
Gestione	iDRAC with Redfish, iDRAC diretto, RACADM, Sincronizzazione rapida 2, NativeEdge
Dimensioni / weight	42.8 X 482 mm; profondità 816.92 mm (rear I/O, con lunetta); 20.42 kg

E3.S Configuration Calculator: Match Density to Workload

The R670’s front bays are built around EDSFF E3.S Gen5 NVMe – the form factor that packs the most flash into 1U. Choose the layout by workload:

Configuration	Capacità	Best for
8 x E3.S NVMe	Fino a 491.52 tubercolosi	General virtualization, mixed I/O
16 x E3.S Gen5	Fino a 983.04 tubercolosi	All-flash SDS, database caching
20 x E3.S Gen5	Fino a 1228.8 tubercolosi	Max-density NVMe, hyperscale
8 x 2.5-inch SATA/NVMe	Fino a 491.52 tubercolosi	Legacy bay compatibility, SATA estates
10 x 2.5-inch SATA	Fino a 38.4 tubercolosi	Cost-focused capacity nodes

Rear bays add up to 2 x E3.S Gen5 NVMe for OS/log duty, keeping the front fully populated with data drives.

Dell PowerEdge R670 1U rack server front view — PowerEdge R670: 1U dual-socket Xeon 6 chassis with dense E3.S Gen5 NVMe front bays.

Front I/O vs Rear I/O: The Cold-Aisle Choice

One feature most 1U servers lack: a choice of service orientation. The R670 ships in rear I/O (hot aisle) O front I/O (cold aisle) configurations. Front I/O puts ports, iDRAC and drive bays on the cold aisle, cutting maintenance time and improving uptime in dense deployments – with a DB9 serial port on the front in that configuration. If your racks are standard rear-service, the rear I/O version keeps familiar cabling. Specify the orientation at order time; it changes the chassis depth (829.44 mm front I/O vs 816.92 mm rear I/O).

Network and DPU Options

Two OCP NIC 3.0 slot (x16 Gen5 each) accept 1GbE through 400GbE cards – enough for dual 100GbE fabric links or a 400GbE spine uplink. For smartNIC architectures, the R670 offers NVIDIA BlueField-3 DPU options (2 x 200GbE B3220 or 1 x 400GbE B3140H), offloading networking, storage and security from the Xeon 6 cores to the DPU. BOSS-N1 lives on a dedicated internal slot (front or rear), so boot storage never consumes a data bay or PCIe slot.

Dell PowerEdge server portfolio lineup — PowerEdge portfolio: the R670 brings Xeon 6 density to the 1U tier alongside 2U and 4U siblings.

Sicurezza & Gestione

Sicurezza. Silicon root of trust anchors boot integrity; Avvio sicuro, cryptographically signed firmware, Secured Component Verification, Cancellazione sicura, System Lockdown and chassis intrusion detection protect from factory to decommission. TPM 2.0 ships FIPS/CC-TCG certified.

Gestione. iDRAC provides out-of-band control with Redfish RESTful API, iDRAC diretto (USB), RACADM CLI and the iDRAC Service Module; Sincronizzazione rapida 2 enables wireless on-site management. Fleet-level, OpenManage Enterprise integrates with VMware vCenter, System Center, Ansible and Terraform, with NativeEdge Orchestrator for edge deployments (asterisk-marked features per Dell availability).

Energia, Raffreddamento & Physical

PSU: Hot-swap redundant: 1500 W / 1100 W / 800 W Titanio, 1100 W / 800 W Platinum, 1800 W HLAC Titanium*, 1500 W 277 VAC*, E 1400 W LVDC (-48 A -60 VCC) for telco environments.
Raffreddamento: Air-cooled with Dell Smart Power and Cooling Technology, or optional Direct Liquid Cooling (rack solution with manifolds/CDU); fino a 4 dual-fan modules (HPR Silver or STD).
Physical: 42.8 X 482 mm, profondità 816.92-829.44 mm by configuration; weight 20.42 kg.

sistema operativo & Hypervisor Support

Canonical Ubuntu Server LTS, RedHat EnterpriseLinux, SUSELinux Enterprise Server, VMware ESXi, and Microsoft Windows Server with Hyper-V (P-core only). For E-core-optimized Linux workloads, the platform’s scheduling works best on modern kernels – confirm the kernel version with your distro.

Buying FAQ

E-core or P-core? E-cores maximize thread density (144 per CPU); P-cores maximize single-thread performance (86 per CPU). Pick by workload mix.
How many NVMe? Fino a 20 x E3.S Gen5 front + 2 x E3.S rear.
400GbE ready? SÌ – OCP 3.0 slots support up to 400GbE cards.
DPU support? NVIDIA BlueField-3 2x200GbE or 1x400GbE.
Remote management? iDRAC with Redfish, iDRAC Direct and RACADM.

Building a dense 1U fleet? See the 2U expansion-focused PowerEdge R760 for mixed workloads. As an authorized Dell partner we offer factory-direct pricing, custom configuration, 3-year warranty and global shipping – contact us for a density/power TCO review.