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The 128GB DIMM That Takes a 2-Socket Server From 4 tb to 8 TB Without Changing Anything Else
A dual-socket Dell R760 has 32 DIMM 슬롯. Populate all 32 with 64GB DIMMs and you get 2 결핵. Populate them with 128GB 3DS RDIMMs and you get 4 결핵. With 256GB 3DS DIMMs, 8 결핵. The Samsung 128GB DDR5-5600 3DS RDIMM is the middle step — the density that turns a memory-hungry virtualization host or an in-memory database server from “can’t fit the workload” 에게 “has headroom for growth.” It is a 3D-stacked (TSV, through-silicon via) registered DIMM with 4 ranks, ECC, and on-die thermal sensors — the densest standard form factor before stepping up to the 256GB tier.
기술 사양
| 매개변수 | 사양 |
|---|---|
| 용량 | 128 DIMM당 GB |
| 유형 | DDR5 SDRAM, 등기 (RDIMM), 3DS (3D Stacked, TSV), ECC |
| 속도 | 5600 MT/s (PC5-44800) |
| CAS 대기 시간 | CL46 (CL46-46-46 at 5600 MT/s) |
| 조직 | 4Rx4 (quad-rank, x4 DRAM devices, 3D-stacked via TSV) |
| 전압 | 1.1VVDD, 1.8V VPP |
| D램 공정 | Samsung 1a-class (14nm) DDR5 D램 |
| 스태킹 | TSV (Through-Silicon Via) 3D stacking — 8 DRAM dies stacked per module |
| 온다이 ECC | 예 (DDR5 표준) |
| 측파대 ECC | 예 (데이터 버스 전반의 표준 ECC) |
| 온도 센서 | 통합 SPD 열 센서 (I2C, iDRAC/iBMC에서 읽기) |
| PMIC | On-DIMM 전원 관리 IC |
| 폼 팩터 | 288-핀 DDR5 RDIMM, 표준 높이 (31.25 mm) |
| 물리적 | 133.35 엑스 31.25 mm, ~21g |
| 온도 | 0섭씨 85도 |
| 적격 플랫폼 (작은 골짜기) | 파워엣지 R660, R760, R770, R860, R960 (4th/5th Gen Xeon) |
| 적격 플랫폼 (xFusion) | Fusionserver 2288h V7, 2488H V7, 5288 V7, 5885H V7 |
| 보증 | 3-년도 (서버와 함께) |
Memory Density Configuration Guide
| 섬기는 사람 | DIMM 슬롯 | 64gb rdimm (1DPC) | 128GB 3DS RDIMM (1DPC) | 256GB 3DS RDIMM (1DPC) | Max with 2DPC |
|---|---|---|---|---|---|
| 델 R470 (1-소켓) | 16 | 512 GB | 1 결핵 | 2 결핵 | 4 결핵 |
| Dell R660/R760/R770 (2-소켓) | 32 | 1 결핵 | 2 결핵 | 4 결핵 | 8 결핵 |
| Dell R860 / xFusion 2488H V7 (4-소켓) | 64 | 2 결핵 | 4 결핵 | 8 결핵 | 16 결핵 |
| Dell R7715 (1-socket EPYC) | 24 | 768 GB | 1.5 결핵 | 3 결핵 | 6 결핵 |
3DS Stacking Explained — Why 128GB Costs More Than Two 64GB DIMMs But Is Worth It
A standard 64GB RDIMM has DRAM chips on two sides of the module (이중 등급). A 128GB 3DS RDIMM stacks DRAM dies vertically using through-silicon vias — 8 dies stacked per module with vertical interconnects. This achieves higher capacity in the same form factor, but the TSV process is more expensive to manufacture, which is why 128GB 3DS costs more than 2x 64GB RDIMMs. The value proposition: a 2-socket server has a fixed 32 DIMM 슬롯. Populating 2x 64GB per slot is impossible — the slot holds one DIMM. 3DS stacking is the only path to 2 TB+ per node on a dual-socket platform.
호환 플랫폼
DDR5-5600 4Rx4 3DS RDIMM. Compatible with Dell PowerEdge 16th Gen (R660, R760, R770, R860, R960) and xFusion FusionServer V7. Verify platform QVL for the specific part number. At 1DPC (1 DIMM per channel), the 128GB 3DS RDIMM runs at DDR5-5600. At 2DPC, speed drops to 4400 MT/s (플랫폼에 따라 다름). Do not mix 128GB 3DS RDIMMs with 64GB RDIMMs on the same channel — rank count mismatch forces both to train down.
Xicuan을 통한 소스
We supply Samsung 128GB DDR5-5600 3DS RDIMMs pre-installed in Dell and xFusion servers with factory-direct pricing, 3-1년 보증, 그리고 글로벌 배송. Our engineers populate DIMMs per the platform optimal population guide.
