델 파워엣지 R670 | 1U 듀얼 소켓 Xeon 6 섬기는 사람

1U 的密度，제온 6 的能效：R670 的平衡术

机架密度和功率预算从来是一对矛盾：塞进 1U 的服务器要么牺牲性能，要么牺牲扩展性。Dell PowerEdge R670 用 Intel Xeon 6 的 E-core/P-core 双核架构建成了这个平衡——1U 双路机箱里支持最多 144 个 E-core 或 86 个 P-core 每路，配合 32 条 DDR5-6400 内存和最多 20 块 E3.S Gen5 NVMe，把”密度优先”和”性能优先”两种形态放进同一个平台。相比上一代，R670 提供最高 1.69 倍的每瓦性能，是虚拟化、云原生、全闪 SDS 和高性能计算的密度型选择。

Core Specifications

E3.S Configuration Calculator: Match Density to Workload

The R670’s front bays are built around EDSFF E3.S Gen5 NVMe – the form factor that packs the most flash into 1U. Choose the layout by workload:

Rear bays add up to 2 x E3.S Gen5 NVMe for OS/log duty, keeping the front fully populated with data drives.

Front I/O vs Rear I/O: The Cold-Aisle Choice

One feature most 1U servers lack: a choice of service orientation. The R670 ships in rear I/O (hot aisle) 또는 front I/O (cold aisle) 구성. Front I/O puts ports, iDRAC and drive bays on the cold aisle, cutting maintenance time and improving uptime in dense deployments – with a DB9 serial port on the front in that configuration. If your racks are standard rear-service, the rear I/O version keeps familiar cabling. Specify the orientation at order time; it changes the chassis depth (829.44 mm front I/O vs 816.92 mm rear I/O).

Network and DPU Options

Two OCP NIC 3.0 슬롯 (x16 Gen5 each) accept 1GbE through 400GbE cards – enough for dual 100GbE fabric links or a 400GbE spine uplink. For smartNIC architectures, the R670 offers NVIDIA BlueField-3 DPU options (2 x 200GbE B3220 or 1 x 400GbE B3140H), offloading networking, storage and security from the Xeon 6 cores to the DPU. BOSS-N1 lives on a dedicated internal slot (front or rear), so boot storage never consumes a data bay or PCIe slot.

보안 & 관리

보안. Silicon root of trust anchors boot integrity; 보안 부트, cryptographically signed firmware, Secured Component Verification, 보안 삭제, System Lockdown and chassis intrusion detection protect from factory to decommission. TPM 2.0 ships FIPS/CC-TCG certified.

관리. iDRAC provides out-of-band control with Redfish RESTful API, iDRAC 다이렉트 (USB), RACADM CLI and the iDRAC Service Module; 빠른 동기화 2 enables wireless on-site management. Fleet-level, OpenManage Enterprise integrates with VMware vCenter, System Center, Ansible and Terraform, with NativeEdge Orchestrator for edge deployments (asterisk-marked features per Dell availability).

힘, 냉각 & 물리적

• 파워서플라이: Hot-swap redundant: 1500 승 / 1100 승 / 800 W 티타늄, 1100 승 / 800 W 플래티넘, 1800 W HLAC Titanium*, 1500 승 277 VAC*, 그리고 1400 W LVDC (-48 에게 -60 VDC) for telco environments.
• 냉각: Air-cooled with Dell Smart Power and Cooling Technology, or optional Direct Liquid Cooling (rack solution with manifolds/CDU); 까지 4 dual-fan modules (HPR Silver or STD).
• 물리적: 42.8 엑스 482 mm, 깊이 816.92-829.44 mm by configuration; weight 20.42 킬로그램.

운영체제 & Hypervisor Support

정식 우분투 서버 LTS, 레드햇 엔터프라이즈 리눅스, 수세 리눅스 엔터프라이즈 서버, VM웨어 ESXi, and Microsoft Windows Server with Hyper-V (P-core only). For E-core-optimized Linux workloads, the platform’s scheduling works best on modern kernels – confirm the kernel version with your distro.

구매 FAQ

• E-core or P-core? E-cores maximize thread density (144 CPU당); P-cores maximize single-thread performance (86 CPU당). Pick by workload mix.
• How many NVMe? 까지 20 x E3.S Gen5 front + 2 x E3.S rear.
• 400GbE ready? 예 – OCP 3.0 slots support up to 400GbE cards.
• DPU support? NVIDIA BlueField-3 2x200GbE or 1x400GbE.
• Remote management? iDRAC with Redfish, iDRAC Direct and RACADM.

Building a dense 1U fleet? See the 2U expansion-focused Poweredge R760 for mixed workloads. As an authorized Dell partner we offer factory-direct pricing, custom configuration, 3-year warranty and global shipping – contact us for a density/power TCO review.