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1U 的密度，زيون 6 的能效：R670 的平衡术
机架密度和功率预算从来是一对矛盾：塞进 1U 的服务器要么牺牲性能，要么牺牲扩展性。Dell PowerEdge R670 用 Intel Xeon 6 的 E-core/P-core 双核架构建成了这个平衡——1U 双路机箱里支持最多 144 个 E-core 或 86 个 P-core 每路，配合 32 条 DDR5-6400 内存和最多 20 块 E3.S Gen5 NVMe，把”密度优先”和”性能优先”两种形态放进同一个平台。相比上一代，R670 提供最高 1.69 倍的每瓦性能，是虚拟化、云原生、全闪 SDS 和高性能计算的密度型选择。
Core Specifications
| يصف | تخصيص |
|---|---|
| شكل عامل | 1يو رف الخادم (rear I/O or front I/O cold-aisle) |
| المعالج | 2 x Intel Xeon 6, يصل إلى 144 E-cores or 86 P-cores per CPU |
| ذاكرة | 32 x DDR5 RDIMM slots, يصل إلى 8 تيرابايت, 6400 جبل/ق |
| تخزين | يصل إلى 20 × EDSFF E3.S Gen5 NVMe (1228.8 تيرابايت) أو 8/10 x 2.5-inch SATA/NVMe |
| Boot | Boss-N1 DC-MHS: HW RAID 1, 2 x M.2 NVMe |
| غارة | Front PERC H965i / H975i / H365i |
| شبكة | 2 X OCP NIC 3.0 فتحات, 1GbE-400GbE; BlueField-3 DPU options |
| PCIe | يصل إلى 5 x Gen5 slots (2 x16 front riser + 3 x16/x8) |
| GPU | يصل إلى 3 x 75 W single-wide |
| إدارة | iDRAC with Redfish, إدراك مباشر, RACADM, مزامنة سريعة 2, NativeEdge |
| أبعاد / weight | 42.8 x 482 مم; عمق 816.92 مم (rear I/O, مع الإطار); 20.42 كلغ |
E3.S Configuration Calculator: Match Density to Workload
The R670’s front bays are built around EDSFF E3.S Gen5 NVMe – the form factor that packs the most flash into 1U. Choose the layout by workload:
| Configuration | سعة | Best for |
|---|---|---|
| 8 x E3.S NVMe | يصل إلى 491.52 تيرابايت | General virtualization, mixed I/O |
| 16 x E3.S Gen5 | يصل إلى 983.04 تيرابايت | All-flash SDS, database caching |
| 20 x E3.S Gen5 | يصل إلى 1228.8 تيرابايت | Max-density NVMe, hyperscale |
| 8 x 2.5-inch SATA/NVMe | يصل إلى 491.52 تيرابايت | Legacy bay compatibility, SATA estates |
| 10 x 2.5-inch SATA | يصل إلى 38.4 تيرابايت | Cost-focused capacity nodes |
Rear bays add up to 2 x E3.S Gen5 NVMe for OS/log duty, keeping the front fully populated with data drives.
Front I/O vs Rear I/O: The Cold-Aisle Choice
One feature most 1U servers lack: a choice of service orientation. The R670 ships in rear I/O (hot aisle) أو front I/O (cold aisle) configurations. Front I/O puts ports, iDRAC and drive bays on the cold aisle, cutting maintenance time and improving uptime in dense deployments – with a DB9 serial port on the front in that configuration. If your racks are standard rear-service, the rear I/O version keeps familiar cabling. Specify the orientation at order time; it changes the chassis depth (829.44 mm front I/O vs 816.92 mm rear I/O).
Network and DPU Options
Two OCP NIC 3.0 فتحات (x16 Gen5 each) accept 1GbE through 400GbE cards – enough for dual 100GbE fabric links or a 400GbE spine uplink. For smartNIC architectures, the R670 offers NVIDIA BlueField-3 DPU options (2 x 200GbE B3220 or 1 x 400GbE B3140H), offloading networking, storage and security from the Xeon 6 cores to the DPU. BOSS-N1 lives on a dedicated internal slot (front or rear), so boot storage never consumes a data bay or PCIe slot.
حماية & إدارة
حماية. Silicon root of trust anchors boot integrity; التمهيد الآمن, cryptographically signed firmware, Secured Component Verification, Secure Erase, System Lockdown and chassis intrusion detection protect from factory to decommission. TPM 2.0 ships FIPS/CC-TCG certified.
إدارة. iDRAC provides out-of-band control with Redfish RESTful API, إدراك مباشر (USB), RACADM CLI and the iDRAC Service Module; مزامنة سريعة 2 enables wireless on-site management. Fleet-level, OpenManage Enterprise integrates with VMware vCenter, System Center, Ansible and Terraform, with NativeEdge Orchestrator for edge deployments (asterisk-marked features per Dell availability).
قوة, تبريد & Physical
- PSU: Hot-swap redundant: 1500 دبليو / 1100 دبليو / 800 ث, 1100 دبليو / 800 W Platinum, 1800 W HLAC Titanium*, 1500 دبليو 277 VAC*, و 1400 W LVDC (-48 ل -60 VDC) for telco environments.
- تبريد: Air-cooled with Dell Smart Power and Cooling Technology, or optional Direct Liquid Cooling (rack solution with manifolds/CDU); يصل إلى 4 dual-fan modules (HPR Silver or STD).
- Physical: 42.8 x 482 مم, عمق 816.92-829.44 mm by configuration; weight 20.42 كلغ.
نظام التشغيل & Hypervisor Support
Canonical Ubuntu Server LTS, ريد هات إنتربرايز لينكس, خادم SUSE Linux Enterprise, VMware ESXI, and Microsoft Windows Server with Hyper-V (P-core only). For E-core-optimized Linux workloads, the platform’s scheduling works best on modern kernels – confirm the kernel version with your distro.
Buying FAQ
- E-core or P-core? E-cores maximize thread density (144 per CPU); P-cores maximize single-thread performance (86 per CPU). Pick by workload mix.
- How many NVMe? يصل إلى 20 x E3.S Gen5 front + 2 x E3.S rear.
- 400GbE ready? Yes – OCP 3.0 slots support up to 400GbE cards.
- DPU support? NVIDIA BlueField-3 2x200GbE or 1x400GbE.
- Remote management? iDRAC with Redfish, iDRAC Direct and RACADM.
Building a dense 1U fleet? See the 2U expansion-focused PowerEdge R760 for mixed workloads. As an authorized Dell partner we offer factory-direct pricing, custom configuration, 3-year warranty and global shipping – contact us for a density/power TCO review.
