저전력 1/2U Dell EMC PowerEdge R650/R650XS/R750/R750XS/R750XA 데이터베이스/데이터 센터/AI/엔터프라이즈 수준/가상화 랙 서버 - Dell/Xfusion/Huawei 서버 판매,중국에서.

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저전력 1/2U Dell EMC PowerEdge R650/R650XS/R750/R750XS/R750XA 데이터베이스/데이터 센터/AI/엔터프라이즈 수준/가상화 랙 서버

EMC PowerEdge R650. Equipped with third-generation Intel ® xeon ® The Dell EMC PowerEdge R650 with an expandable processor is an excellent rack mounted server designed to meet the needs of applications Performance and acceleration. The PowerEdge R650 is a dual slot/1U rack mounted server that provides excellent performance for demanding workloads. It supports every The CPU has 8 메모리 채널 및 최대 32 DDR4 DIMM, with a speed of 3200 MT/s. 게다가, to meet the actual throughput improvement, PowerEdge R650 supports PCIe 4.0 그리고 최대 24 NVME 운전, while improving air cooling capabilities and adding optional direct liquid cooling to support higher performance Power and heat dissipation requirements. This will make the PowerEdge R650 an ideal

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EMC PowerEdge R650.
Equipped with third-generation Intel ® xeon ® The Dell EMC PowerEdge R650 with an expandable processor is an excellent rack mounted server designed to meet the needs of applications Performance and acceleration. The PowerEdge R650 is a dual slot/1U rack
mounted server that provides excellent performance for demanding workloads. It supports every The CPU has 8 메모리 채널 및 최대 32 DDR4 DIMM, with a speed of 3200 MT/s. 게다가, to meet the actual throughput improvement, PowerEdge R650 supports PCIe 4.0 그리고 최대 24 NVME 운전, while improving air cooling capabilities and adding optional direct liquid cooling to support higher performance Power and heat dissipation requirements. This will make the PowerEdge R650 an ideal server for data center standardization across a wide range of workloads, 포함: data Libraries and analytics, high-frequency transactions, traditional enterprise IT, 가상 데스크탑 인프라, and even high-performance HPC or AI/ML environments, as well as dense 1U form factors, are required GPU support in the specifications.

Dell EMC PowerEdge R650 can provide excellent performance Performance of server power, 고속 메모리 및 용량, 입출력
bandwidth And storage to meet data needsvery suitable for: Traditional enterprise IT • Database and analysis Virtual desktop
infrastructure AI/ML and HPC
모델
D ELL R650
Appearance Specifications
1유
프로세서
Supports up to two 3rd generation Intel Xeon Scalable processors (까지 40 프로세서당 코어)
Processor interconnection
Intel Hyperpath Interconnect (UPI)
메모리
32 DDR4 DIMM 슬롯, supporting maximum RDIMM 2 TB or LRDIMM 4 결핵, 최대 속도 3200 MT/s까지 8 NVDIMM slots, up to a
maximum of 128 GB 최대 16 Intel Permanent Memory 200 시리즈 (BPS) 슬롯, 최대 용량 8 TB Only supports registered
ECC DDR4 DIMMs
Storage Drive
Internal controllers: 미닛 H745, HBA355I, A50, H345, H755, H755N • Boot optimized storage subsystem (보스-S2): 하드웨어 RAID 2 x M.2 SSD
240 GB 또는 480 GB 외부 MIN (RAID): 분 H840, HBA355E
PCIe slot
까지 3 PCIe 4.0 half height slots (all x16 except for one x8 slot with SNAPI I/O option) 또는 2 PCIe (4.0) full height slots
USB port
Front port: •1 dedicated iDRAC Direct micro USB • 1 USB 2.0 • 1 VGA
후면 포트:
●1 USB 2.0
1 serial (선택 과목)
1 USB 3.0
2 X 이더넷
1 VGA
internal port:
1 USB 3.0 (선택 과목)
GPU
Up to three 75W single width GPUs
• 800 W AC/240 HVDC • 1100 W AC/240 HVDC
• 1400 W AC/240 HVDC
시스템 관리
Encryption signature firmware • Safety guidance • Secure erasure • Silicon wafer trust root System lockout (requires iDRAC9
Enterprise or Datacenter) TPM 1.2/2.0 FIPS, CC-TCG 인증, 한의학 2.0 (선택 과목)
Networking options
1 x OCP 3.0 (x8 PCIe channel)

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