Dell PowerEdge R770 Review: Modular, Puissant, and AI Supported - Vendre un serveur Dell/Xfusion/Huawei,De Chine.

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Dell PowerEdge R770 Review: Modular, Puissant, and AI Supported

Dell’s PowerEdge R7x0 series servers have long been the cornerstone of data centers, renowned for their superior manufacturing quality, thoughtful design, performance, density, and reliability, as well as their versatile 2U form factor. These servers have been constantly evolving to meet ever-changing demands. Now, with the launch of Dell PowerEdge R770, the series has made a significant leap forward.

The TR770 is equipped with Intel’s new Xeon 6 processor series for the first time, including Xeon 6500 et 6700 P and E core processors. It marks Dell’s first comprehensive adoption of the OCP Data Center Modular Hardware Systems (DC MHS) standard in its mainstream server product line. These two changes together indicate a significant shift in functionality and design philosophy.

The launch of R770 comes at a time when data centers are facing increasing pressure. The workload is becoming increasingly diverse and demanding. The continuous growth of data has driven the demand for powerful analytics and databases. From training complex models to deploying real-time inference, artificial intelligence is no longer a niche application, but a core business driver that requires significant computing power and professional acceleration.

En même temps, people are also very concerned about energy efficiency and optimizing overall cost of ownership. En outre, the industry is increasingly looking to adopt open standards to promote innovation, enhance interoperability, and minimize supplier lock-in. The R770 features new processor options and adopts OCP DC MHS, designed to address these challenges head-on.

The R770 processor adopts Intel Xeon 6 series processors, including the 6700 et 6500 series, and integrates performance and efficiency cores built on the Socket E2 (LGA4710-2) platform. In this review, we pay special attention to the P series SKUs.
Intel uses a module based design to build these processors, combining I/O modules with one or two computing modules. This achieves scalability within the series, with a maximum configuration of 86 P-cores (XCC) when using two computing modules, and a minimum configuration of 48 P-cores (HCC) ou 16 P-cores (LCC) when using a single computing module.

A key difference between these processors and the previous generation Sapphire and Emerald Rapids processors is that all Xeon 6 processors generally come with built-in accelerators. This includes Intel QuickAssist technology for encryption and compression, Intel Data Stream Accelerator for data mobility, Intel Memory Analysis Accelerator for database and analytics acceleration, and Intel Dynamic Load balancers for network processing efficiency.

The memory and I/O bandwidth have also been significantly upgraded. The Xeon 6700/6500 P core series supports 8-channel DDR5 memory. They also pave the way for multiplex grade DIMMs (MRIMMs), providing speeds of up to 8800 MT/s. In terms of I/O, these processors support PCIe 5.0 and CXL 2.0. In a dual slot configuration, the platform can provide up to 88 PCIe channels per slot (a total of 176 channels).

Although there are differences between the P and E cores, the Xeon 6 series has an instruction set BIOSConsistent support for drivers, operating systems/applications, and RAS functionality simplifies integration and management of different deployment types. The P-core variant is designed for workloads that require critical performance, AI acceleration, high memory bandwidth, and a large amount of I/O per core; Think about demanding databases, HPC simulations, advanced analytics, and various AI applications.

processeur 两个 Intel Xeon 6 processeur,每个处理器最多有 144 个 E 核或 86 个 P 核
内存 32 个 DDR5 DIMM 插槽支持最大 8 TB RDIMM速度高达 6400 MT/s,仅支持已注册的 ECC DDR5 DIMM
存储控制器 内部启动启动优化存储子系统 (BOSS-N1 DC-MHS):FRÈRE 1、2 x M.2 NVMe SSD 或 M.2 插入器板 (DC-MHS):2 x M.2 NVMe SSD 或 USB内部控制器前置 PERC H965i前置 PERC H975i前置 PERC H365i
前后托架
  • 无背板配置
  • 最多 8 个 EDSFF E3.S Gen5 NVMe (SSD),最大 122.88 TB,还配备 FIO 配置
  • 最多 16 个 EDSFF E3.S Gen5 NVMe (SSD),最大 245.76 TB,还配备 FIO 配置
  • 多达 32 个 EDSFF E3.S Gen5 NVMe (SSD),最大容量 489.6 TB
  • 最多 8 2.5 英寸 SAS/SATA/NVMe (SSD),最大 122.88 TB
  • 最多 8 2.5 英寸通用磁盘最大 245.6 TB,最多 16 2.5 英寸 SAS/SATA (SSD),最大 61.44 TB
  • 最多 24 2.5 英寸 SAS/SATA (SSD),最大 92.16 TB,
  • 最多 16 2.5 英寸 SAS/SATA(SSD)+ 8 2.5 英寸 NVME)最大 92.16 TB
  • 多达 40 个 EDSFF E3.S Gen5 NVMe (SSD),最大容量 614.4 TB
  • 背面最多 4 个 EDSFF E3.S Gen5 NVMe (SSD),最大 61.2 TB
热插拔电源
  • 800 W 白金 100—240 VAC 或 240 VCC
  • 1100 W 白金 100—240 VAC 或 240 VCC
  • 1500 W 钛金 100—240 VAC 或 240 VCC
  • 1100 W 钛金 100—240 VAC 或 240 VCC
  • 3200 W 钛金 200—240 VAC 或 240 VCC
  • 800 W 钛金 100—240 VAC 或 240 VCC
  • 3200 O 277 VAC 和 336 HVDC 钛金
  • 1400 瓦 -48VDC 60 毫米
  • 1500 O 277 VAC 和 336 HVDC 钛金
  • 2400 W 钛金 100—240 VAC 或 240 VCC 1800 W HLAC 钛金版 200—240 VAC 或 240 VCC
冷却选项 空气冷却和直接液体冷却(DLC 是一种机架解决方案需要机架歧管和冷却分配单元 (CDU) 才能运行)
风机 高性能银牌 (HPR SLVR) 风扇/高性能金牌 (HPR GOLD) 风扇最多 6 个热插拔风扇
尺寸和重量 高度 – 86.8 毫米(3.42 英寸)宽度 – 482 毫米(18.97 英寸)重量 – 28.53 千克(62.89 磅)深度(后置 I/O 配置)– 802.40 毫米(31.59 英寸)(含挡板),801.51 毫米(31.56 英寸)(不含挡板)深度(前置 I/O 配置)– 814.52 毫米(32.07 英寸)(不含挡板)
外形 2U机架服务器
嵌入式管理 iDRAC、IDRAC Direct、带有 Redfish 的 iDRAC RESTful APIRACADM CLIiDRAC 服务模块 (iSM)、NativeEdge EndpointNativeEdge Orchestrator
表圈 可选安全挡板
安全性 加密签名固件静态数据加密(具有本地或外部密钥管理的 SED)安全启动安全组件验证(硬件完整性检查)硅信任根系统锁定系统锁定(需要 iDRAC10 Enterprise 或 Datacenter)机箱入侵检测、MTP 2.0 FIPS、CC-TCG 认证
网络选项
  • 4 个 OCP NIC 3.0 卡(可​​选)和 1GbE、10Porter、25Porter、100GbE 和 400GbE
  • 插槽 4 1 X 8 1 X 16 Gen5 OCP 3.0
  • 插槽 10 1 X 8 1 X 16 OCP 3.0,插槽 34 1 X 16 Gen5 OCP 3.0(位于前提升板上)
  • 插槽 38 前转接板上有 1 X 16 Gen 5 OCP 3.0
  • BOSS 插槽 34 1 X 4 CHEF,插槽 6 1 X 4 CHEF
GPU 选项 最多 6 75 W FHHL 或最多 2 350 W DWFL
端口 前端口:1 个 USB 2.0 C 型端口、1 个 USB 2.0 A 型端口(可选)、1 个 Mini-DisplayPort(可选)、1 个 DB9 串行(带前置 I/O 配置)、1 个用于 iDRAC 管理的专用以太网端口后端口:1 个用于 iDRAC 管理的专用以太网端口、1 个 VGA、2 个 USB 3.1 A 型端口内部端口:1 个 USB 3.1 A 型端口
PCIe
  • 最多两个 PCIe 插槽(x16 连接器)
  • 插槽 31 1 X 16 Gen5 全高 – 前提升板上的半长或全长
  • 插槽 36 1 X 16 Gen5 全高 – 前部提升板上的半长
  • 最多八个 PCIe 插槽(x8 和 x16 连接器)
  • 插槽 1 1 X 8 Gen5 全高 – 半长
  • 插槽 2 1 X 16 Gen5 双宽全长或 1 X 8 Gen5 全高 – 半长
  • 插槽 3 1 X 16 Gen5 全高 – 半长或 1 X 16 Gen5 薄型
  • 插槽 4 1 X 16 Gen5 全高 – 半长或 1 X 8 Gen5 全高 – 半长或 1 X 8 1 X 16 OCP 3.0
  • 插槽 5 2 X 16 Gen5 全高 – 半长或 1 X 8 Gen5 全高 – 半长
  • 插槽 7 1 X 16 Gen5 全高 – 半长或 1 X 16 Gen5 双宽全长或 1 X 8 Gen5 全高 – 半长插槽 8 1 X 16 Gen5 全高 – 半长或 1 X 8 Gen5 全高 – 半长
  • 插槽 9 1 X 16 Gen5 全高 – 半长或 1 X 8 Gen5 全高 – 半长或 1 X 16 薄型 – 半长
操作系统和管理程序 Canonical Ubuntu Server LTS带有 Hyper-V 的 Microsoft Windows Server、Red Hat Enterprise Linux、Serveur d'entreprise SUSE Linux、带有 vSphere 的 VMware

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