Los servidores de la serie PowerEdge R7X0 de Dell han sido durante mucho tiempo la piedra angular de los centros de datos, Reconocido por su calidad de fabricación superior, thoughtful design, performance, density, and reliability, as well as their versatile 2U form factor. These servers have been constantly evolving to meet ever-changing demands. Now, with the launch of Dell PowerEdge R770, the series has made a significant leap forward.
The TR770 is equipped with Intel’s new Xeon 6 processor series for the first time, including Xeon 6500 y 6700 P and E core processors. It marks Dell’s first comprehensive adoption of the OCP Data Center Modular Hardware Systems (DC MHS) standard in its mainstream server product line. These two changes together indicate a significant shift in functionality and design philosophy.
The launch of R770 comes at a time when data centers are facing increasing pressure. The workload is becoming increasingly diverse and demanding. The continuous growth of data has driven the demand for powerful analytics and databases. From training complex models to deploying real-time inference, artificial intelligence is no longer a niche application, but a core business driver that requires significant computing power and professional acceleration.
Al mismo tiempo, people are also very concerned about energy efficiency and optimizing overall cost of ownership. Además, the industry is increasingly looking to adopt open standards to promote innovation, enhance interoperability, and minimize supplier lock-in. The R770 features new processor options and adopts OCP DC MHS, designed to address these challenges head-on.
The R770 processor adopts Intel Xeon 6 series processors, including the 6700 y 6500 serie, and integrates performance and efficiency cores built on the Socket E2 (LGA4710-2) platform. In this review, we pay special attention to the P series SKUs.
Intel uses a module based design to build these processors, combining I/O modules with one or two computing modules. This achieves scalability within the series, with a maximum configuration of 86 P-cores (XCC) when using two computing modules, and a minimum configuration of 48 P-cores (HCC) o 16 P-cores (LCC) when using a single computing module.
A key difference between these processors and the previous generation Sapphire and Emerald Rapids processors is that all Xeon 6 processors generally come with built-in accelerators. This includes Intel QuickAssist technology for encryption and compression, Intel Data Stream Accelerator for data mobility, Intel Memory Analysis Accelerator for database and analytics acceleration, and Intel Dynamic Load balancers for network processing efficiency.
The memory and I/O bandwidth have also been significantly upgraded. The Xeon 6700/6500 P core series supports 8-channel DDR5 memory. They also pave the way for multiplex grade DIMMs (MRIMMs), providing speeds of up to 8800 MT/s. In terms of I/O, these processors support PCIe 5.0 and CXL 2.0. In a dual slot configuration, the platform can provide up to 88 PCIe channels per slot (a total of 176 channels).
Although there are differences between the P and E cores, the Xeon 6 series has an instruction set BIOS、 Consistent support for drivers, operating systems/applications, and RAS functionality simplifies integration and management of different deployment types. The P-core variant is designed for workloads that require critical performance, AI acceleration, high memory bandwidth, and a large amount of I/O per core; Think about demanding databases, HPC simulations, advanced analytics, and various AI applications.
procesador | 两个 Intel Xeon 6 procesador,每个处理器最多有 144 个 E 核或 86 个 P 核 |
内存 | 32 个 DDR5 DIMM 插槽,支持最大 8 TB RDIMM,速度高达 6400 MT/s,仅支持已注册的 ECC DDR5 DIMM |
存储控制器 | 内部启动:启动优化存储子系统 (BOSS-N1 DC-MHS):HERMANO 1、2 x M.2 NVMe SSD 或 M.2 插入器板 (DC-MHS):2 x M.2 NVMe SSD 或 USB、内部控制器:前置 PERC H965i、前置 PERC H975i、前置 PERC H365i |
前后托架 |
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热插拔电源 |
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冷却选项 | 空气冷却和直接液体冷却(DLC 是一种机架解决方案,需要机架歧管和冷却分配单元 (CDU) 才能运行) |
风机 | 高性能银牌 (HPR SLVR) 风扇/高性能金牌 (HPR GOLD) 风扇,最多 6 个热插拔风扇 |
尺寸和重量 | 高度 – 86.8 毫米(3.42 英寸),宽度 – 482 毫米(18.97 英寸),重量 – 28.53 千克(62.89 磅),深度(后置 I/O 配置)– 802.40 毫米(31.59 英寸)(含挡板),801.51 毫米(31.56 英寸)(不含挡板),深度(前置 I/O 配置)– 814.52 毫米(32.07 英寸)(不含挡板) |
外形 | 2U机架服务器 |
嵌入式管理 | iDRAC、iDRAC directo、带有 Redfish 的 iDRAC RESTful API、CLI de RACADM、iDRAC 服务模块 (iSM)、NativeEdge Endpoint、NativeEdge Orchestrator |
表圈 | 可选安全挡板 |
安全性 | 加密签名固件、静态数据加密(具有本地或外部密钥管理的 SED)、安全启动、安全组件验证(硬件完整性检查)、硅信任根、系统锁定、系统锁定(需要 iDRAC10 Enterprise 或 Datacenter)、机箱入侵检测、TPM 2.0 FIP、CC-TCG 认证 |
网络选项 |
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GPU 选项 | 最多 6 个 75 W FHHL 或最多 2 个 350 W DWFL |
端口 | 前端口:1 个 USB 2.0 C 型端口、1 个 USB 2.0 A 型端口(可选)、1 个 Mini-DisplayPort(可选)、1 个 DB9 串行(带前置 I/O 配置)、1 个用于 iDRAC 管理的专用以太网端口;后端口:1 个用于 iDRAC 管理的专用以太网端口、1 个 VGA、2 个 USB 3.1 A 型端口;内部端口:1 个 USB 3.1 A 型端口 |
PCIe |
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操作系统和管理程序 | Servidor canónico Ubuntu LTS、带有 Hyper-V 的 Microsoft Windows Server、Red Hat Enterprise Linux、Servidor empresarial SUSE Linux、带有 vSphere 的 VMware |